gaiser bonding tools

10/24 · SPT to purchase Gaiser-branded bonding tools business for back-end semiconductor processing and other custom products October 24, 02:14 PM Eastern

Return shipping will be paid by: Seller Brand: Gaiser Tool Condition: Used condition, with normal signs of wear. Comes as shown, please check pics.

We develop and manufacture advanced bonding tools for a broad range of applications, providing end-to-end solutions to a wide array of customers who are market leaders in their respective fields. Our product offerings vary from standard designs to customized solutions that address different packaging challenges and application requirements.

For correct fixing of the bond tools, set to 35cNm. H65. Unplugging Probes. For plugging capillaries and wedges, 25 pieces per set. H66. Tungsten Wire. For plugging capillaries and wedges, 25 pieces per set. H67. Tweezers. For gripping and threading wire and ribbon. H68. Bond Sample.

The deep access bonding wedge is a combination of both a Gaiser Products Group The following bonding machines use the deep access tool: Hybond Model.

We claim 1. A bonding tool for placing and holding a fine wire against a metallic surface during application of energy thereto comprising in combination, a tool body having work portion and a portion adapted to be connected to a holder, said work portion being formed with a concave surface whose concave shape is along planes at right angles to the wire being bonded, an irregular finish on said

AboutCoorsTek Ventura (CoorsTek Gaiser Bonding Tools) CoorsTek Ventura (CoorsTek Gaiser Bonding Tools) is located at 4544 McGrath St in Ventura, California 93003. CoorsTek Ventura (CoorsTek Gaiser Bonding Tools) can be contacted via phone at (805) 644-5583 for pricing, hours and directions.

Gaiser® Precision Bonding Tools Product Catalog TECHNICAL CERAMICS EXPERTS Leaders in Advanced Technical Ceramics CoorsTek® is the world’s largest manufacturer of technical

A wedge is a tool for bonding wire to a bond pad, which is typically on a printed circuit board that will become part of a micro-electronic device. The bond may be made to a very small bond pad, recessed about 2 to 8 microns below a protective overcoat or passivation layer.

CoorsTek is your partner for enabling innovations in semiconductor processing. Our broad portfolio of semiconductor grade materials, component production capabilities, and application engineering services help you solve big challenges. Engineered technical ceramics are used in the semiconductor industry because of their excellent material

1890 ROTH Group Lyss, Switzerland 1964 Aprova Ltd. Lyss, Switzerland 1974 Small Precision Tools Inc. California, USA 1979 SPT Asia Pte Ltd. Singapore 1982 Moldinject, Perfectamould AG. Lyss, Switzerland 1991 Small