tpt wire bonder

The HB30 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and pre-production runs and small scale production lines. Easy operation with TFT Touch 

TPT-HB05-Wire-Bonder Manual bonder can be configured for bonding of 38 µm aluminum wire or 25 µm gold wire. Wedge bonding and ball bonding available.

TPT HB16 Wire bonder Description Semi-automatic wire bonder with motorized Z- and Y-axes, used to create electrical interconnects between dies and packages/printed circuit boards. Features Capable of ball, wedge, bump, and ribbon bonding 17 µm to 75 µm wire thickness, gold or aluminum wire Motorized Y- & Z-axis, manual X-axis

A TPT Wire Bonder foi criada em 1996 na Alemanha e desde então fornece sistemas de wire e die bonder e acessórios para microeletrônica .

Products. Tabletop Semiautomatic / manual wire bonder. This is very flexible and precise tabletop wire bonding machine. TPT offers both wedge and ball bonding 

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Description. Automatic Wire Bonder With motorized Z-Y-X Axes and Bond Head Rotation The motorized Z-Y-X Axes and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes. Option Pattern Recognition Teaser Bonding with TPT's automatic Wire Bonder HB100: Pattern Recognition and automatic bonding a series of

TPT Wire Bonder Co. KG, Karlsfeld, Germany, District Court of Munich HRA 100969: Total assets, Earnings, Network, Financial information.

The bonding technology is based on our popular semi-automatic bonders. It is completely engineered and manufactured in our German factory. HB100 Automatic Wedge & Ball Bonder Motorized Z- X- Y- Axis & Bondhead Rotation www.tpt.de Made in Germany Accessories:

TPT Wirebonder www.tpt.de. Page 6 of 53. September 2016. 5. Introduction. The HB XX ultrasonic wire bonder is characterized by vertical feed of wire or 

Jun 09,  · Accelonix Benelux - Distributor of TPT Wire Bonding Solutions for more information about our micro electronics packaging solutions please visit : www.accelon